martes, 12 de septiembre de 2017

Integrated Circuit (IC) Packaging Techniques

shared this article with you from Inoreader

In electronics manufacturing, Integrated circuit (IC) packaging is the final stage of semiconductor device fabrication. In this process, a tiny block of semiconducting material is encapsulated in a supporting case that prevents physical damage and corrosion.

Upon Completion of the slideshow, you will be able to understand the following points:

  • Package Overview
  • Through-Hole package
  • Surface mount package
  • Chip-Scale Package (CSP)
  • Wire Bonded BGA
  • FC-BGA
  • Wafer Level Chip-Scale Package (WL-CSP)
  • Advantages of WL-CSP IC

The post Integrated Circuit (IC) Packaging Techniques appeared first on Electronics For You.

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