Integrated Circuit (IC) Packaging Techniques

eferemail shared this article with you from Inoreader Integrated Circuit (IC) Packaging Techniques Vía Electronics For You In electronics manufacturing, Integrated circuit (IC) packaging is the final stage of semiconductor device fabrication. In this process, a tiny block of semiconducting material is encapsulated in a supporting case that prevents physical damage and corrosion. Upon Completion of the slideshow, you will be able to understand the following points: Package Overview Through-Hole package Surface mount package Chip-Scale Package (CSP) Wire Bonded BGA FC-BGA Wafer Level Chip-Scale Package (WL-CSP) Advantages of WL-CSP IC IC Packaging from santoshnimbal   The post Integrated Circuit (IC) Packaging Techniques appeared first on Electronics For You. View on the web Inoreader is a light and fast RSS Reader. Follow us on Twitter and Facebook.